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Journal of Nanomaterials
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Journal of Nanomaterials
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2012
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Article
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Tab 2
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Research Article
Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging
Table 2
EDX analysis of CuAl IMC crack region post-UHAST 96 hr opens: non-green mold compound (Leg 4).
Leg
Element
Atomic %
4 (non-green mold compound)
O
8.64
Al
8.17
Si
1.89
Cl
0.68
Cu
78.23
Ta
2.40