Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging

Table 2

EDX analysis of CuAl IMC crack region post-UHAST 96 hr opens: non-green mold compound (Leg 4).

Leg	Element	Atomic %
4 (non-green mold compound)	O	8.64
	Al	8.17
	Si	1.89
	Cl	0.68
	Cu	78.23
	Ta	2.40