Research Article
Electrical and Thermal Behavior of Copper-Epoxy Nanocomposites Prepared via Aqueous to Organic Phase Transfer Technique
Table 3
Thermal properties of pure epoxy, epoxy/MDA, and Cu-epoxy/MDA samples.
| | | TGA | DTG | DSC | CTE | | | Degradation
temperature
range (°C) | Weight loss (%) | (°C) | (°C) | Before
(ppm/°C) | After
(ppm/°C) |
| | Pure epoxy | | 320–370
370–440 | 85.6
12.7 | 355 | −12.1 | — | — |
| | Cured epoxy/MDA | | 380–435 | 90.7 | 400 | 114.9 | 87.7 | 155.0 |
| | Cured Cu-epoxy/MDA | 0.05 vol.% | 372–440 | 83.4 | 410 | 122.7 | 76.8 | 146.0 | | 1.00 vol.% | 360–432 | 80.6 | 385 | 123.4 | 102.9 | 161.3 |
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