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Journal of Nanomaterials
Volume 2012, Article ID 895131, 8 pages
http://dx.doi.org/10.1155/2012/895131
Research Article

Elastic Modulus Determination of Al-Cu Film Alloys Prepared by Thermal Diffusion

1Departamento de Física Aplicada, Centro de Investigación y de Estudios Avanzados del IPN Unidad-Mérida, A.P. 73-Cordemex, 97310 Mérida, YUC, Mexico
2Materiales Nanoestructurados, Centro de Investigación en Materiales Avanzados, S.C., Avenida Miguel de Cervantes 120, Complejo Industrial Chihuahua, 31109 Chihuahua, CHIH, Mexico
3Unidad de Materiales, Centro de Investigación Científica de Yucatán A.C., Calle 43 No. 130 Col. Chuburná de Hidalgo, 97200 Mérida, YUC, Mexico

Received 8 May 2012; Accepted 19 June 2012

Academic Editor: Hamed Bahmanpour

Copyright © 2012 E. Huerta et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

Elastic moduli of 50–250 nm thick Al-50 at % Cu film alloys deposited by thermal evaporation on Kapton substrates and postformed by thermal diffusion are investigated. Formation of the Al2Cu alloy phase was confirmed by X-ray photoelectron spectroscopy (XPS). Surface morphology was examined by atomic force microscopy (AFM) and scanning electron microscopy (SEM) before and after tensile mechanical testing. Force-strain curves of the Al-Cu alloy were obtained by subtracting the effect of the force-strain Kapton curves from the corresponding curves of the Al-Cu/Kapton system. A reduction in the elastic modulus of the Al-Cu alloys from 106.1 to 77.8 GPa with the increase of alloy thickness was obtained. Measured elastic moduli were between the reported bulk modulus for Al and Cu. Reductions in the surface roughness and increments in the grain size were measured after tensile testing of the Al-Cu alloys.