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Journal of Nanomaterials
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Journal of Nanomaterials
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2013
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Article
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Fig 7
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Research Article
Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging
Figure 7
Typical CuAl IMC microcracks post extended HAST stress (1817 hr).