Low Temperature Flex-on-Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding
Figure 18
Pressure cooker test results of (a) conventional Ni ACFs, (b) conventional Sn58Bi solder ACFs, and (c) PVDF nanofiber/Sn58Bi solder ACFs.
