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Journal of Nanomaterials
Volume 2013 (2013), Article ID 934986, 5 pages
http://dx.doi.org/10.1155/2013/934986
Research Article

Effects of Free Surface and Heterogeneous Residual Internal Stress on Stress-Driven Grain Growth in Nanocrystalline Metals

1State Key Laboratory for Strength and Vibration of Mechanical Structures, School of Aerospace, Xi’an Jiaotong University, Xi’an 710049, China
2State-Key Laboratory for Mechanical Behavior of Material, Xi’an Jiaotong University, Xi’an 710049, China
3INM-Leibniz Institute for New Materials, Campus D2 2, 66123 Saarbrucken, Germany

Received 18 June 2013; Revised 24 August 2013; Accepted 28 August 2013

Academic Editor: Tianxi Liu

Copyright © 2013 F. Wang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Linked References

  1. T. J. Rupert, D. S. Gianola, Y. Gan, and K. J. Hemker, “Experimental observations of stress-driven grain boundary migration,” Science, vol. 326, no. 5960, pp. 1686–1690, 2009. View at Publisher · View at Google Scholar · View at Scopus
  2. M. Legros, D. S. Gianola, and K. J. Hemker, “In situ TEM observations of fast grain-boundary motion in stressed nanocrystalline aluminum films,” Acta Materialia, vol. 56, no. 14, pp. 3380–3393, 2008. View at Publisher · View at Google Scholar · View at Scopus
  3. J. C. M. Li, “Mechanical grain growth in nanocrystalline copper,” Physical Review Letters, vol. 96, no. 21, Article ID 215506, 4 pages, 2006. View at Publisher · View at Google Scholar · View at Scopus
  4. D. S. Gianola, S. van Petegem, M. Legros, S. Brandstetter, H. van Swygenhoven, and K. J. Hemker, “Stress-assisted discontinuous grain growth and its effect on the deformation behavior of nanocrystalline aluminum thin films,” Acta Materialia, vol. 54, no. 8, pp. 2253–2263, 2006. View at Publisher · View at Google Scholar · View at Scopus
  5. K. Zhang, J. R. Weertman, and J. A. Eastman, “Rapid stress-driven grain coarsening in nanocrystalline Cu at ambient and cryogenic temperatures,” Applied Physics Letters, vol. 87, no. 6, Article ID 061921, 3 pages, 2005. View at Publisher · View at Google Scholar · View at Scopus
  6. K. Zhang, J. R. Weertman, and J. A. Eastman, “The influence of time, temperature, and grain size on indentation creep in high-purity nanocrystalline and ultrafine grain copper,” Applied Physics Letters, vol. 85, no. 22, pp. 5197–5199, 2004. View at Publisher · View at Google Scholar · View at Scopus
  7. M. Ames, J. Markmann, R. Karos, A. Michels, A. Tschöpe, and R. Birringer, “Unraveling the nature of room temperature grain growth in nanocrystalline materials,” Acta Materialia, vol. 56, no. 16, pp. 4255–4266, 2008. View at Publisher · View at Google Scholar · View at Scopus
  8. X. Z. Liao, A. R. Kilmametov, R. Z. Valiev et al., “High-pressure torsion-induced grain growth in electrodeposited nanocrystalline Ni,” Applied Physics Letters, vol. 88, no. 2, Article ID 021909, 3 pages, 2006. View at Publisher · View at Google Scholar · View at Scopus
  9. D. S. Gianola, D. H. Warner, J. F. Molinari, and K. J. Hemker, “Increased strain rate sensitivity due to stress-coupled grain growth in nanocrystalline Al,” Scripta Materialia, vol. 55, no. 7, pp. 649–652, 2006. View at Publisher · View at Google Scholar · View at Scopus
  10. M. Dao, L. Lu, R. J. Asaro, J. T. M. de Hosson, and E. Ma, “Toward a quantitative understanding of mechanical behavior of nanocrystalline metals,” Acta Materialia, vol. 55, no. 12, pp. 4041–4065, 2007. View at Publisher · View at Google Scholar · View at Scopus
  11. T. Zhu and J. Li, “Ultra-strength materials,” Progress in Materials Science, vol. 55, no. 7, pp. 710–757, 2010. View at Publisher · View at Google Scholar · View at Scopus
  12. J. A. Wert, X. Huang, G. Winther, W. Pantleon, and H. F. Poulsen, “Revealing deformation microstructures,” Materials Today, vol. 10, no. 9, pp. 24–32, 2007. View at Publisher · View at Google Scholar · View at Scopus
  13. J. Chen, L. Lu, and K. Lu, “Hardness and strain rate sensitivity of nanocrystalline Cu,” Scripta Materialia, vol. 54, no. 11, pp. 1913–1918, 2006. View at Publisher · View at Google Scholar · View at Scopus
  14. B. Zhu, R. J. Asaro, P. Krysl, K. Zhang, and J. R. Weertman, “Effects of grain size distribution on the mechanical response of nanocrystalline metals: part II,” Acta Materialia, vol. 54, no. 12, pp. 3307–3320, 2006. View at Publisher · View at Google Scholar · View at Scopus
  15. X. Y. Li, Y. J. Wei, W. Yang, and H. J. Gao, “Competing grain-boundary- and dislocation-mediated mechanisms in plastic strain recovery in nanocrystalline aluminum,” Proceedings of the National Academy of Sciences of the United States of America, vol. 106, no. 38, pp. 16108–16113, 2009. View at Publisher · View at Google Scholar · View at Scopus
  16. J. Rajagopalan, J. H. Han, and M. T. A. Saif, “Plastic deformation recovery in freestanding nanocrystalline aluminum and gold thin films,” Science, vol. 315, no. 5820, pp. 1831–1834, 2007. View at Publisher · View at Google Scholar · View at Scopus
  17. J. Rajagopalan, J. H. Han, and M. T. A. Saif, “On plastic strain recovery in freestanding nanocrystalline metal thin films,” Scripta Materialia, vol. 59, no. 9, pp. 921–926, 2008. View at Publisher · View at Google Scholar · View at Scopus
  18. Y. J. Wei, A. F. Bower, and H. J. Gao, “Recoverable creep deformation due to heterogeneous grain-boundary diffusion and sliding,” Scripta Materialia, vol. 57, no. 10, pp. 933–936, 2007. View at Publisher · View at Google Scholar · View at Scopus
  19. Z. W. Shan, R. K. Mishra, S. A. Syed Asif, O. L. Warren, and A. M. Minor, “Mechanical annealing and source-limited deformation in submicrometre-diameter Nicrystals,” Nature Materials, vol. 7, no. 2, pp. 115–119, 2008. View at Publisher · View at Google Scholar · View at Scopus
  20. D. Jang and J. R. Greer, “Size-induced weakening and grain boundary-assisted deformation in 60 nm grained Ni nanopillars,” Scripta Materialia, vol. 64, no. 1, pp. 77–80, 2011. View at Publisher · View at Google Scholar · View at Scopus
  21. S. V. Bobylev and I. A. Ovid'ko, “Grain boundary rotations in solids,” Physical Review Letters, vol. 109, no. 17, Article ID 175501, 5 pages, 2012. View at Google Scholar
  22. M. Jin, A. M. Minor, E. A. Stach, and J. W. Morris Jr., “Direct observation of deformation-induced grain growth during the nanoindentation of ultrafine-grained Al at room temperature,” Acta Materialia, vol. 52, no. 18, pp. 5381–5387, 2004. View at Publisher · View at Google Scholar · View at Scopus
  23. R. S. Kottada and A. H. Chokshi, “Low temperature compressive creep in electrodeposited nanocrystalline nickel,” Scripta Materialia, vol. 53, no. 8, pp. 887–892, 2005. View at Publisher · View at Google Scholar · View at Scopus
  24. G. J. Fan, L. F. Fu, D. C. Qiao, H. Choo, P. K. Liaw, and N. D. Browning, “Grain growth in a bulk nanocrystalline Co alloy during tensile plastic deformation,” Scripta Materialia, vol. 54, no. 12, pp. 2137–2141, 2006. View at Publisher · View at Google Scholar · View at Scopus
  25. G. J. Fan, L. F. Fu, H. Choo, P. K. Liaw, and N. D. Browning, “Uniaxial tensile plastic deformation and grain growth of bulk nanocrystalline alloys,” Acta Materialia, vol. 54, no. 18, pp. 4781–4792, 2006. View at Publisher · View at Google Scholar · View at Scopus
  26. D. Pan, T. G. Nieh, and M. W. Chen, “Strengthening and softening of nanocrystalline nickel during multistep nanoindentation,” Applied Physics Letters, vol. 88, no. 16, Article ID 161922, 2006. View at Publisher · View at Google Scholar · View at Scopus
  27. S. Brandstetter, K. Zhang, A. Escuadro, J. R. Weertman, and H. van Swygenhoven, “Grain coarsening during compression of bulk nanocrystalline nickel and copper,” Scripta Materialia, vol. 58, no. 1, pp. 61–64, 2008. View at Publisher · View at Google Scholar · View at Scopus
  28. Y. B. Wang, B. Q. Li, M. L. Sui, and S. X. Mao, “Deformation-induced grain rotation and growth in nanocrystalline Ni,” Applied Physics Letters, vol. 92, no. 1, Article ID 011903, 2008. View at Publisher · View at Google Scholar · View at Scopus
  29. A. Kulovits, S. X. Mao, and J. M. K. Wiezorek, “Microstructural changes of nanocrystalline nickel during cold rolling,” Acta Materialia, vol. 56, no. 17, pp. 4836–4845, 2008. View at Publisher · View at Google Scholar · View at Scopus
  30. B. L. Boyce and H. A. Padilla II, “Anomalous fatigue behavior and fatigue-induced grain growth in nanocrystalline nickel alloys,” Metallurgical and Materials Transactions A, vol. 42, no. 7, pp. 1793–1804, 2011. View at Publisher · View at Google Scholar · View at Scopus
  31. Z. H. Cao, P. Y. Li, Z. H. Jiang, and X. K. Meng, “Rolling deformation induced reduction of rate sensitivity and enhancement of hardness in nanocrystalline NiFe alloys,” Journal of Physics D, vol. 44, no. 29, Article ID 295403, 2011. View at Publisher · View at Google Scholar · View at Scopus
  32. J. A. Sharon, P.-C. Su, F. B. Prinz, and K. J. Hemker, “Stress-driven grain growth in nanocrystalline Pt thin films,” Scripta Materialia, vol. 64, no. 1, pp. 25–28, 2011. View at Publisher · View at Google Scholar · View at Scopus
  33. S. Ni, Y. B. Wang, X. Z. Liao et al., “Grain growth and dislocation density evolution in a nanocrystalline Ni-Fe alloy induced by high-pressure torsion,” Scripta Materialia, vol. 64, no. 4, pp. 327–330, 2011. View at Publisher · View at Google Scholar · View at Scopus
  34. H. van Swygenhoven, P. M. Derlet, and A. G. Frøseth, “Nucleation and propagation of dislocations in nanocrystalline fcc metals,” Acta Materialia, vol. 54, no. 7, pp. 1975–1983, 2006. View at Publisher · View at Google Scholar · View at Scopus
  35. Z. Budrovic, H. van Swygenhoven, P. M. Derlet, S. van Petegem, and B. Schmitt, “Plastic deformation with reversible peak broadening in nanocrystalline nickel,” Science, vol. 304, no. 5668, pp. 273–276, 2004. View at Publisher · View at Google Scholar · View at Scopus
  36. D. Caillard, F. Mompiou, and M. Legros, “Grain-boundary shear-migration coupling. II. Geometrical model for general boundaries,” Acta Materialia, vol. 57, no. 8, pp. 2390–2402, 2009. View at Publisher · View at Google Scholar · View at Scopus
  37. M. Velasco, H. van Swygenhoven, and C. Brandl, “Coupled grain boundary motion in a nanocrystalline grain boundary network,” Scripta Materialia, vol. 65, no. 2, pp. 151–154, 2011. View at Publisher · View at Google Scholar · View at Scopus
  38. J. W. Cahn and J. E. Taylor, “A unified approach to motion of grain boundaries, relative tangential translation along grain boundaries, and grain rotation,” Acta Materialia, vol. 52, no. 16, pp. 4887–4898, 2004. View at Publisher · View at Google Scholar · View at Scopus
  39. P. L. Gai, K. Zhang, and J. Weertman, “Electron microscopy study of nanocrystalline copper deformed by a microhardness indenter,” Scripta Materialia, vol. 56, no. 1, pp. 25–28, 2007. View at Publisher · View at Google Scholar · View at Scopus