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Journal of Nanomaterials
Volume 2014, Article ID 518520, 8 pages
Research Article

Agglomeration and Dendritic Growth of Cu/Ti/Si Thin Film

1State Key Laboratory of Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, China
2State Key Laboratory of Digital Manufacturing Equipment & Technology, Huazhong University of Science and Technology, Wuhan 430074, China

Received 12 September 2013; Accepted 20 December 2013; Published 30 January 2014

Academic Editor: Sherine Obare

Copyright © 2014 Qi-jing Lin et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Qi-jing Lin, Weixuan Jing, Shu-ming Yang, Zhuang-de Jiang, and Chen-ying Wang, “Agglomeration and Dendritic Growth of Cu/Ti/Si Thin Film,” Journal of Nanomaterials, vol. 2014, Article ID 518520, 8 pages, 2014.