Evaluation of Degradation in Nanofilled Adhesive Resins Using Quantitative Light-Induced Fluorescence

Table 1

Composition of the adhesive systems used in the study.

Adhesive (manufacturer)	Components (lot no.)
D/E resin; (BISCO, Schaumburg, IL, USA)	Bis-GMA, HEMA, and urethane dimethacrylates (1400001272)
Adper Single Bond Plus; (3M/ESPE, St. Paul, MN, USA)	Bis-GMA, HEMA, dimethacrylates, polyalkenoic acid copolymer, initiators, water, ethanol, and silica filler (N538311)
G-Bond; (GC, Tokyo, Japan)	4-MET, phosphoric ester monomer, UDMA, TEGDMA, acetone, water, stabilizer, silica filler, water, and photoinitiator (1307091)

4-MET: 4-methacryloxyethyltrimellitate; UDMA: urethane dimethacrylate; TEGDMA: triethyleneglycol dimethacrylate; bis-GMA: bisphenol A diglycidyl ether dimethacrylate; and HEMA: 2-hydroxyethyl methacrylate.