Review Article

Applications of Thermoresponsive Magnetic Nanoparticles

Table 2

Thermoresponsive polymer-magnetic nanoparticle composites for magnetic separations of biomolecules and cells.

Magnetic core-size (diameter) Polymer/analyteLCSTAffinity ligand/applicationReference/note

Fe3O4 polystyrene- (Therma-Max) 100 nmPINAAm/thyroid stimulating hormone (TSH)22°Cβ-antibody/TSH isolation and detection (Immunoassay)[46]

Fe3O4-SiO2-80 nmPoly(2-(2-methoxyethoxy)ethyl methacrylate-co-methacrylic acid-co-N-(4-vinyl)-benzyl iminodiacetic acid) P(MEO2MA-co-MAA-co-VBIDA)/Lysosome15–25°CMolecularly imprinted lysosome receptor/thermal capture and release of lysosome[47]

γ-Fe2O3-SiO2-5 μmPoly(N-vinylcaprolactam) (PNVCL)/Bovine Serum Albumin (BSA)33.4°CHydrophobic interaction/protein separation-purification[48]/size measurement was based on SEM of whole assembly

Fe3O4-100 nm Poly(polyethylene glycol-co-N-isopropylacrylamide) poly(PEG-co-PINAAm)/lysozyme40°CHydrophobic interaction/protein separation-purification[49]/size measurement based on TEM of aggregates due to inclusion complexes between cyclodextrin and PEG

PLGA-iron oxide MNPs- (Meliorum technologies, Rochester, NY) silica microparticles-50–100 μmPoly(N-isopropylacrylamide-co-allylamine) poly(NIPAAm-co-AH)/stem cells33°CCD34 antibodies/isolation, enrichment, and detachment of endothelial progenitor cells (EPCs)[50]/size measurement was based on SEM of whole assembly

Fe3O4-100 nmPoly(N,N′-isopropylacrylamide-co-N-methacroyl-N′-biotinylpropylenediamine) (P(NIPAAm-co-MBPDA))/ZZ-displaying yeast cells30°CAnti-goat IgG (heavy and light chains) (rabbit IgG)/affinity selection and separation of target cells from model yeast cells[51]/size measurement was based on DLS of whole assembly

Fe3O4–dextran- (Therma-Max) 70 nmPoly(N-acryloyl glycinamide-co-N-(3-biotinamidepropyl)-methacrylamide) P(NAGAM-co-NBPMA)18°C (UCST)(i) CD4 antibody/capture and enrichment of Arabidopsis protoplasts (plant cells)
(ii) Silkworm storage protein (SP2)/anti-SP2 antibody
[52]/size measurement was based on DLS of whole assembly