A Study on Toxic Acidic Vapor Removal Behaviors of Continuously Nanostructured Copper/Nickel-Coated Nanoporous Carbons

Table 1

Formulation of the copper and nickel electroplating bath and operation conditions.

	Cu plating	Ni plating
Composition	CuSO4·5H2O 10 g/L	NiSO4·6H2O 280 g/L
	H2SO4 20 mL/L	NiCl2·6H2O 40 g/L
		H3BO3 30 g/L
pH	3.0~3.5	4.5~5.0
Temperature (°C)	25	45
Current density (A/m^2)	30	10~50