Low-Temperature Sintering Bonding Using Silver Nanoparticle Paste for Electronics Packaging

Figure 5

SEM images of interface microstructure of joints with different sintering temperatures: (a) low magnification at 150°C; (b) low magnification at 250°C; (c) low magnification at 350°C; (d) high magnification at 150°C; (e) high magnification at 250°C; (f) high magnification at 350°C.

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(b)

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