Low-Temperature Sintering Bonding Using Silver Nanoparticle Paste for Electronics Packaging

Figure 8

The fracture surface morphology of the joints. (a) Macromorphology. (b) Fracture at 150°C. (c) Fracture at 250°C. (d) Fracture at 350°C.

(a)

(b)

(c)

(d)