The Reliability Improvement of Cu Interconnection by the Control of Crystallized <svg xmlns:xlink="http://www.w3.org/1999/xlink" xmlns="http://www.w3.org/2000/svg" style="vertical-align:-0.2631903pt" id="M1" height="8.60421pt" version="1.1" viewBox="-0.0657574 -8.34102 10.6147 8.60421" width="10.6147pt"><g transform="matrix(.018,0,0,-0.018,0,0)"><path id="g5-223" d="M563 442L553 454L479 439C463 404 440 354 416 322H414C389 422 344 454 283 454C151 454 21 310 21 162C21 48 73 -12 135 -12C182 -12 249 19 325 126H327C339 20 368 -12 407 -12C452 -12 507 21 557 110L530 136C508 107 493 92 480 92C462 92 453 123 430 253C459 292 528 386 563 442ZM318 186C290 133 235 76 202 76C175 76 154 108 154 184C154 275 198 406 247 406C288 406 313 294 318 186Z"/></g></svg>-<svg xmlns:xlink="http://www.w3.org/1999/xlink" xmlns="http://www.w3.org/2000/svg" style="vertical-align:-4.5247pt" id="M2" height="16.8328pt" version="1.1" viewBox="-0.0657574 -12.3081 63.6037 16.8328" width="63.6037pt"><g transform="matrix(.018,0,0,-0.018,0,0)"><path id="g187-85" d="M616 481C611 545 606 633 605 675H580C563 656 549 650 523 650H121C92 650 79 653 64 675H39C37 624 31 551 27 478H64C77 528 89 562 106 579C120 596 138 606 221 606H255V133C255 48 245 42 161 35V0H487V35C399 42 389 48 389 133V606H434C493 606 518 601 536 583S568 531 580 479L616 481Z"/></g><g transform="matrix(.018,0,0,-0.018,9.847,0)"><path id="g187-98" d="M465 45L455 77C444 72 433 69 421 69C404 69 389 81 389 128V293C389 349 380 392 337 425C310 445 280 454 239 454C182 443 111 409 73 383C51 366 38 353 38 335C38 309 74 285 101 285C121 285 136 293 143 319C151 350 160 374 171 388C180 400 191 406 205 406C241 406 265 371 265 308V278C242 258 165 234 106 212C54 192 30 168 30 116C30 54 81 -12 165 -12C185 -12 232 21 270 46C274 34 281 21 295 9C308 -3 329 -12 356 -12L465 45ZM265 79C249 67 238 63 223 63C200 63 163 84 163 139C163 174 179 192 210 208C231 219 247 229 265 239V79Z"/></g><g transform="matrix(.018,0,0,-0.018,18.182,0)"><path id="g187-48" d="M304 665H234L17 -45H87L304 665Z"/></g><g transform="matrix(.018,0,0,-0.018,24.029,0)"><use xlink:href="#g187-85"/></g><g transform="matrix(.018,0,0,-0.018,33.878,0)"><use xlink:href="#g187-98"/></g><g transform="matrix(.018,0,0,-0.018,42.211,0)"><path id="g187-79" d="M724 650H480V616C554 612 574 595 579 552C582 523 587 476 587 387V211H584L201 650H16V616C59 612 81 604 100 580S120 538 120 472V264C120 176 114 131 110 98C106 55 83 39 27 35V0H272V35C198 38 181 57 176 101C173 131 168 176 168 264V488H171L587 -10H635V387C635 476 641 523 644 554C649 599 670 613 724 616V650Z"/></g><g transform="matrix(.013,0,0,-0.013,55.664,4.308)"><path id="g50-121" d="M545 403C545 425 527 451 498 451C448 451 400 404 312 286L290 341C262 412 246 451 219 451C182 451 138 404 92 345L112 323C152 368 169 378 181 378C192 378 201 359 216 321L257 214C184 115 142 69 113 69C102 69 93 73 88 79S78 89 68 89C47 89 24 61 24 40C24 8 49 -12 75 -12C125 -12 175 31 271 175L312 64C330 15 357 -12 382 -12C421 -12 475 35 515 98L496 121C466 88 439 62 420 62C402 62 384 92 363 147L325 247C349 280 374 309 397 333C422 361 446 381 462 381C471 381 481 374 488 366C493 360 499 357 505 357C521 357 545 380 545 403Z"/></g></svg> Diffusion Barrier

<div>The XRD patterns of (a) TaN-1 and TaN-2 films and (b) Ta/TaN-1 and Ta/TaN-2 bilayers deposited on SiO<sub>2</sub>.</div>

Journal of Nanomaterials

fig2

Figure 2

Figure 2: The Reliability Improvement of Cu Interconnection by the Control of Crystallized <svg xmlns:xlink="http://www.w3.org/1999/xlink" xmlns="http://www.w3.org/2000/svg" style="vertical-align:-0.2631903pt" id="M1" height="8.60421pt" version="1.1" viewBox="-0.0657574 -8.34102 10.6147 8.60421" width="10.6147pt"><g transform="matrix(.018,0,0,-0.018,0,0)"><path id="g5-223" d="M563 442L553 454L479 439C463 404 440 354 416 322H414C389 422 344 454 283 454C151 454 21 310 21 162C21 48 73 -12 135 -12C182 -12 249 19 325 126H327C339 20 368 -12 407 -12C452 -12 507 21 557 110L530 136C508 107 493 92 480 92C462 92 453 123 430 253C459 292 528 386 563 442ZM318 186C290 133 235 76 202 76C175 76 154 108 154 184C154 275 198 406 247 406C288 406 313 294 318 186Z"/></g></svg>-<svg xmlns:xlink="http://www.w3.org/1999/xlink" xmlns="http://www.w3.org/2000/svg" style="vertical-align:-4.5247pt" id="M2" height="16.8328pt" version="1.1" viewBox="-0.0657574 -12.3081 63.6037 16.8328" width="63.6037pt"><g transform="matrix(.018,0,0,-0.018,0,0)"><path id="g187-85" d="M616 481C611 545 606 633 605 675H580C563 656 549 650 523 650H121C92 650 79 653 64 675H39C37 624 31 551 27 478H64C77 528 89 562 106 579C120 596 138 606 221 606H255V133C255 48 245 42 161 35V0H487V35C399 42 389 48 389 133V606H434C493 606 518 601 536 583S568 531 580 479L616 481Z"/></g><g transform="matrix(.018,0,0,-0.018,9.847,0)"><path id="g187-98" d="M465 45L455 77C444 72 433 69 421 69C404 69 389 81 389 128V293C389 349 380 392 337 425C310 445 280 454 239 454C182 443 111 409 73 383C51 366 38 353 38 335C38 309 74 285 101 285C121 285 136 293 143 319C151 350 160 374 171 388C180 400 191 406 205 406C241 406 265 371 265 308V278C242 258 165 234 106 212C54 192 30 168 30 116C30 54 81 -12 165 -12C185 -12 232 21 270 46C274 34 281 21 295 9C308 -3 329 -12 356 -12L465 45ZM265 79C249 67 238 63 223 63C200 63 163 84 163 139C163 174 179 192 210 208C231 219 247 229 265 239V79Z"/></g><g transform="matrix(.018,0,0,-0.018,18.182,0)"><path id="g187-48" d="M304 665H234L17 -45H87L304 665Z"/></g><g transform="matrix(.018,0,0,-0.018,24.029,0)"><use xlink:href="#g187-85"/></g><g transform="matrix(.018,0,0,-0.018,33.878,0)"><use xlink:href="#g187-98"/></g><g transform="matrix(.018,0,0,-0.018,42.211,0)"><path id="g187-79" d="M724 650H480V616C554 612 574 595 579 552C582 523 587 476 587 387V211H584L201 650H16V616C59 612 81 604 100 580S120 538 120 472V264C120 176 114 131 110 98C106 55 83 39 27 35V0H272V35C198 38 181 57 176 101C173 131 168 176 168 264V488H171L587 -10H635V387C635 476 641 523 644 554C649 599 670 613 724 616V650Z"/></g><g transform="matrix(.013,0,0,-0.013,55.664,4.308)"><path id="g50-121" d="M545 403C545 425 527 451 498 451C448 451 400 404 312 286L290 341C262 412 246 451 219 451C182 451 138 404 92 345L112 323C152 368 169 378 181 378C192 378 201 359 216 321L257 214C184 115 142 69 113 69C102 69 93 73 88 79S78 89 68 89C47 89 24 61 24 40C24 8 49 -12 75 -12C125 -12 175 31 271 175L312 64C330 15 357 -12 382 -12C421 -12 475 35 515 98L496 121C466 88 439 62 420 62C402 62 384 92 363 147L325 247C349 280 374 309 397 333C422 361 446 381 462 381C471 381 481 374 488 366C493 360 499 357 505 357C521 357 545 380 545 403Z"/></g></svg> Diffusion Barrier 

Journal of Nanomaterials

The Reliability Improvement of Cu Interconnection by the Control of Crystallized - Diffusion Barrier

Figure 2