The Reliability Improvement of Cu Interconnection by the Control of Crystallized - Diffusion Barrier

Figure 5

(a) Upstream and (b) downstream EM test results taken from the test Cu interconnection structures with Ta/TaN-1, Ta/TaN-2, and Ta/TaN-3 diffusion barriers. The insets of (a) and (b) are the XTEM images, showing the failure modes of the test Cu interconnection structures with Ta/TaN-3 and Ta/TaN-1 diffusion barriers, respectively.

(a)

(b)