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Journal of Nanomaterials
Volume 2015 (2015), Article ID 917935, 6 pages
http://dx.doi.org/10.1155/2015/917935
Research Article

The Reliability Improvement of Cu Interconnection by the Control of Crystallized - Diffusion Barrier

1Process Technology Development Division, Powerchip Technology Corporation, Hsinchu Science Park, Hsinchu 30078, Taiwan
2Logic Technology Development Division, Powerchip Technology Corporation, Hsinchu Science Park, Hsinchu 30078, Taiwan
3Instrument Technology Research Center, National Applied Research Laboratories, Hsinchu, Taiwan

Received 27 October 2014; Revised 14 February 2015; Accepted 15 February 2015

Academic Editor: Zhenbo Wang

Copyright © 2015 Wei-Lin Wang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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