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Journal of Nanomaterials
Volume 2016, Article ID 4984230, 5 pages
http://dx.doi.org/10.1155/2016/4984230
Research Article

Effect of Strain on Thermal Conductivity of Si Thin Films

1College of Mechanical and Electrical Engineering, Northeast Forestry University, Harbin 150040, China
2The State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, China

Received 1 March 2016; Revised 29 April 2016; Accepted 10 May 2016

Academic Editor: Yan Wang

Copyright © 2016 Xingli Zhang and Guoqiang Wu. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Linked References

  1. D. Terris, K. Joulain, D. Lemonnier, D. Lacroix, and P. Chantrenne, “Prediction of the thermal conductivity anisotropy of Si nanofilms: results of several numerical methods,” International Journal of Thermal Sciences, vol. 48, no. 8, pp. 1467–1476, 2009. View at Publisher · View at Google Scholar · View at Scopus
  2. S. Ju and X. Liang, “Thermal conductivity of nanocrystalline silicon by direct molecular dynamics simulation,” Journal of Applied Physics, vol. 112, no. 6, article 064305, 2012. View at Publisher · View at Google Scholar · View at Scopus
  3. A. Bodapati, P. K. Schelling, S. R. Phillpot, and P. Keblinski, “Vibrations and thermal transport in nanocrystalline silicon,” Physical Review B, vol. 74, no. 24, Article ID 245207, 2006. View at Publisher · View at Google Scholar · View at Scopus
  4. S. H. Ju, X. G. Liang, and X. H. Xu, “Out-of-plane thermal conductivity of polycrystalline silicon nanofilm by molecular dynamics simulation,” Journal of Applied Physics, vol. 110, no. 5, Article ID 054318, 2011. View at Publisher · View at Google Scholar · View at Scopus
  5. X. L. Zhang and Z. W. Sun, “Effects of vacancy structural defects on the thermal conductivity of silicon thin films,” Semiconductor, vol. 32, Article ID 053002, 2011. View at Google Scholar
  6. M. Adamcyk, J. H. Schmid, T. Tiedje et al., “Comparison of strain relaxation in InGaAsN and InGaAs thin films,” Applied Physics Letters, vol. 80, no. 23, pp. 4357–4359, 2002. View at Publisher · View at Google Scholar · View at Scopus
  7. S. Bhowmick and V. B. Shenoy, “Effect of strain on the thermal conductivity of solids,” Journal of Chemical Physics, vol. 125, no. 16, article 164513, 2006. View at Publisher · View at Google Scholar · View at Scopus
  8. Y. Y. Zhang, Q. X. Pei, X. Q. He, and Y.-W. Mai, “A molecular dynamics simulation study on thermal conductivity of functionalized bilayer graphene sheet,” Chemical Physics Letters, vol. 622, pp. 104–108, 2015. View at Publisher · View at Google Scholar · View at Scopus
  9. X. Wang and S. P. Shen, “Effects of temperature and strain on thermal properties of Ni/Al laminated structure,” Computational Materials Science, vol. 84, pp. 13–17, 2014. View at Publisher · View at Google Scholar · View at Scopus
  10. Y. Xu and G. Li, “Strain effect analysis on phonon thermal conductivity of two-dimensional nanocomposites,” Journal of Applied Physics, vol. 106, no. 11, Article ID 114302, 2009. View at Publisher · View at Google Scholar · View at Scopus
  11. J. Tersoff, “New empirical approach for the structure and energy of covalent systems,” Physical Review B, vol. 37, no. 12, pp. 6991–7000, 1988. View at Publisher · View at Google Scholar · View at Scopus
  12. P. Juncl and R. Jullien, “Molecular-dynamics calculation of the thermal conductivity of vitreous silica,” Physical Review B—Condensed Matter and Materials Physics, vol. 59, no. 21, pp. 13707–13711, 1999. View at Publisher · View at Google Scholar · View at Scopus
  13. K. Jung, M. Cho, and M. Zhou, “Thermal and mechanical response of [0001]-oriented GaN nanowires during tensile loading and unloading,” Journal of Applied Physics, vol. 112, no. 8, Article ID 083522, 2012. View at Publisher · View at Google Scholar · View at Scopus
  14. X. Li, K. Maute, M. L. Dunn, and R. Yang, “Strain effects on the thermal conductivity of nanostructures,” Physical Review B, vol. 81, no. 24, Article ID 245318, 2010. View at Publisher · View at Google Scholar · View at Scopus
  15. P. K. Schelling, S. R. Phillpot, and P. Keblinski, “Comparison of atomic-level simulation methods for computing thermal conductivity,” Physical Review B—Condensed Matter and Materials Physics, vol. 65, no. 14, Article ID 144306, 2002. View at Google Scholar · View at Scopus
  16. P. Chantrenne and J.-L. Barrat, “Finite size effects in determination of thermal conductivities: comparing molecular dynamics results with simple models,” Journal of Heat Transfer, vol. 126, no. 4, pp. 577–585, 2004. View at Publisher · View at Google Scholar · View at Scopus
  17. Z. Xu and M. J. Buehler, “Strain controlled thermomutability of single-walled carbon nanotubes,” Nanotechnology, vol. 20, no. 18, Article ID 185701, 2009. View at Publisher · View at Google Scholar · View at Scopus
  18. J. Zhang, X. He, L. Yang et al., “Effect of tensile strain on thermal conductivity in monolayer graphene nanoribbons: a molecular dynamics study,” Sensors, vol. 13, no. 7, pp. 9388–9395, 2013. View at Publisher · View at Google Scholar · View at Scopus
  19. L. Cao, A. Hunter, I. J. Beyerlein, and M. Koslowski, “The role of partial mediated slip during quasi-static deformation of 3D nanocrystalline metals,” Journal of the Mechanics and Physics of Solids, vol. 78, pp. 415–426, 2015. View at Publisher · View at Google Scholar · View at MathSciNet · View at Scopus