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Journal of Nanomaterials
Volume 2016, Article ID 8243605, 10 pages
http://dx.doi.org/10.1155/2016/8243605
Research Article

Thermal Stresses Analysis and Optimized TTP Processes to Achieved CNT-Based Diaphragm for Thin Panel Speakers

Department of Materials Science and Engineering, Da-Yeh University, Changhua 51591, Taiwan

Received 6 March 2016; Accepted 7 June 2016

Academic Editor: Ying-Lung D. Ho

Copyright © 2016 Feng-Min Lai and Chang-Yi Peng. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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