Research Article

Thermal Stresses Analysis and Optimized TTP Processes to Achieved CNT-Based Diaphragm for Thin Panel Speakers

Table 3

Compare the stresses’ decrease progressively with Özel et al.’s results and ANSYS method.

Material propertiesÖzel et al. [3]
()
ANSYS method
()
Differential

W + Si3N4−92%−95.56%3.86%
W + Al2O3−136%−125.58%7.66%
W + TiC−121%−119.27%1.42%