Thermal Properties of Silver Nanoparticle Sintering Bonding Paste for High-Power LED Packaging

Figure 3

SEM images of interface microstructure of joints with different sintering temperatures and sintering pressure: 200°C sintering (a and b); 200°C low-pressure sintering (c and d); and 450°C sintering (e and f).

(a)

(b)

(c)

(d)

(e)

(f)