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Journal of Nanomaterials
Volume 2016, Article ID 9265948, 8 pages
Research Article

Molecular Dynamics Simulation of Nanoindentation of Cu/Au Thin Films at Different Temperatures

1State Key Laboratory of Coal Mine Disaster Dynamics and Control, Chongqing University, Chongqing 400044, China
2College of Aerospace Engineering, Chongqing Key Laboratory of Heterogeneous Material Mechanics, Chongqing University, Chongqing 400044, China

Received 4 September 2016; Accepted 25 October 2016

Academic Editor: Fengyuan Lu

Copyright © 2016 Qibin Li et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Two methods, deposition method and ideal modeling based on lattice constant, are used to prepare three modulation periods’ (1.8 nm Cu/3.6 nm Au, 2.7 nm Cu/2.7 nm Au, and 3.6 nm Cu/1.8 nm Au) thin films for nanoindentation at different temperatures. The results show that the temperature will weaken the hardness of thin films. The deposition method and the formation of coherent interface will result in a lot of defects in thin films. These defects can reduce the residual stress in the thin films which is caused by the external force. The proposed system will provide potential benefits in designing the microstructures for thin films.