Research Article
Buffer Film Assisted Growth of Dense MWCNTs on Copper Foils for Flexible Electrochemical Applications
Table 1
Sputtered conditions for deposition of Inconel and 304 SS films.
| | Parameters | Inconel buffer film | 304 SS catalytic film |
| | Base pressure (mbar) | 5 × 10−5 | 5 × 10−5 | | Working pressure (mbar) | 3 × 10−3 | 3 × 10−3 | | Substrate temperature (°C) | R.T | R.T | | Distance between the target and the substrate (cm) | 10 | 10 | | Ar flow rates (sccm) | 5 | 5 | | DC power (W) | 217 | 280 | | Sputtering time (s) | 60 | 30 |
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