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Journal of Nanomaterials
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Journal of Nanomaterials
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2017
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Article
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Fig 3
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Research Article
Surface Morphology and Electrical Resistivity in Polycrystalline Au/Cu/Si(100) System
Figure 3
AFM images of the alloys (samples A, C, and E) after 1 h of thermal diffusion. Bilayer thickness: 50, 150, and 250 nm, respectively.