Research Article

Surface Morphology and Electrical Resistivity in Polycrystalline Au/Cu/Si(100) System

Table 1

Principal features and deposition parameters of samples analyzed in this work. The thickness (nm), deposition rate (Å/s), and RMS roughness (nm) are also included.

SampleAu : Cu (at.%)Deposition rate (Å/s)Cu thickness (nm)Au thickness (nm)Bilayer thickness (nm) (K)Annealing time (h)RMS roughness (nm)

A25 : 75334165066010.9257
B25 : 753683210066014.1952
C25 : 7531014915066015.1907
D25 : 7531356520066019.1413
E25 : 7531698125066019.8804