Research Article
Dielectric and Electrical Properties of WS2 Nanotubes/Epoxy Composites and Their Use for Stress Monitoring of Structures
Figure 2
Mold for samples preparation: (a) mold body and lower movable part which is inserted to the cavity during compression. This device configuration allows the samples ejection after the compression. Upper movable part, encountering the compressing pressure (device assembly is shown in the Supplementary Information Fig. S3). (b) Samples configuration for the three-point bending test.
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