Influences of Bath Chemistry and Plating Variables on Characteristics of Electroless Ni–P Films on Si Wafers from Alkaline Citrate Solutions

Figure 8

SEM images of the top surface of the alloy films deposited with different plating times: (a) 15 min, (b) 30 min, (c) 60 min (NiSO₄ = 25 g·L⁻¹, NaH₂PO₂ = 40 g·L⁻¹, Na₃C₆H₅O₇ = 20 g·L⁻¹, pH = 9.0, T = 70°C).

(a)

(b)

(c)