Influences of Bath Chemistry and Plating Variables on Characteristics of Electroless Ni–P Films on Si Wafers from Alkaline Citrate Solutions

Table 2

Bath composition and characteristics of selected samples.

Sample	Ni^2+ (g·L^−1)	Cit^− (g·L^−1)	(g·L^−1)	(min)	(mg)		pH	Ni (wt%)	P (wt%)	Figure
Number 14	25	20	40	15	4.0	70°C	10	89 ± 0.2	11 ± 0.2	7(b), 9(b), 9(d)
Number 17	25	20	40	60	11.5	70°C	9	90 ± 0.2	10 ± 0.2	8(a), 8(b), 8(c)
Number 19	25	20	20	15	0.3	70°C	9	95 ± 5.4	9.3 ± 0.3	7(c), 9(a), 9(c)
Number 21	25	20	20	15	0.4	70°C	12	87 ± 0.3	13 ± 0.3	7(d)
Number 23	25	20	40	15	0.1	60°C	9	89 ± 0.6	11 ± 0.6	7(e)
Number 25	25	20	40	15	2.2	90°C	9	89 ± 0.2	9 ± 0.2	7(f)

Note: w^{^} is the mass gain of sample, t^~ is the plating time, T^# is the plating temperature; plating time of 15 min and 30 min, respectively.