Research Article
A Rapid Bonding Method for Fabricating Mixing Microfluidic Chip Based on Micromachining Technology
Table 1
Comparison of different bonding methods.
| Object | Equipment | Bonding step | Bonding time |
| Glass/glass | Muffle furnace | Two | More than 12 hours | Glass/silicon | Electrostatic bonding machine | One | Several hours | Glass/PDMS and PDMS/PDMS | Plasma cleaning machine | Two | More than half an hour | PMMA/PMMA | Hot-embossing machine | One | More than half an hour | Glass/polyurethane | No | Two | Only 2 minutes |
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