Review Article
Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys
Figure 27
The evolution of the interfacial Cu6Sn5 of Sn-/Cu with different reflow cycles. The 1st reflow cycle (a, b), the 2rd reflow cycle (c, d), and the 6th reflow cycle (e, f) [110].
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(b) |
(c) |
(d) |
(e) |
(f) |