Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys

Table 1

Typical type of addition in composite Sn-based lead-free solder [45].

Type	Kinds of additions	Representative material	Advantage	Disadvantage
Non-reactive	Oxide	Al2O3 [19–21], TiO2 [24, 25, 27, 50], ZnO [49, 51–53], ZrO2 [28, 29], Fe2O3 [54, 55], La2O3 [56], CeO2 [57]	Stabilization	Worse retention rate
	Carbide	TiC [30], SiC [31]
	Carbon nanometer	CNTs [35–37], graphene [38–40], fullerenes [41–43]
	Elementary substance	Diamond [58]
Reactive	Metal	Ni [8–10], Mn [11], Bi [12], Co [13, 14], Cr [15], Al [9], Sb [10], Fe [16], rare earth (RE) [17, 18]	Coarsening of IMC	Formation of IMC
	IMCs	Cu6Sn5 [32–34]
Compound type	Organic macromolecule	Epoxy [59, 60]	Good retention rate	High cost, deterioration of serve reliability
	Metal-plated carbon nanometer	Ag-decorated CNTs [35], Sn-decorate CNTs [61]