Journal of Nanomaterials / 2020 / Article / Tab 2 / Review Article
Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys Table 2 The effect of incorporation on the wettability of SAC composite solder.
Sn-Ag-Cu based solder Wettability Optimum addition Sn-Ag-Cu-ZnO [49 ] ZnO addition resulted in the decrease of wetting angles, which implies the improvement of wettability 0.5 wt% Sn-Ag-Cu-Al2 O3 [21 ] Addition of Al2 O3 with the range of 0.01-0.5 wt% resulted in the increase of wetting area — Sn-Ag-Cu-Fe2 O3 [55 ] Wettability increases first and then decreases with the increase of addition ranged from 0 to 1 wt% 0.4 wt% Sn-Ag-Cu-La2 O3 [56 ] Spreading area increases with the addition range from 0 to 0.05% La2 O3 , then decreases in 0.1 wt% La2 O3 0.05 wt% Sn-Ag-Cu-CuZnAl [70 , 71 ] Spreading ratio improvement and contact angle decreased due to the addition of CuZnAl particles 0.5 wt% Sn-Ag-Cu-TiC [30 ] Contact angles of composite solder reduced first and then improved with the increase of TiC content 0.1 wt% Sn-Ag-Cu-nano-Al [69 ] Wetting area increases with the improvement of Al nanoparticles when the content is less than 0.1 wt%, and then the wettability deteriorates with the increase of Al nanoparticles when the content is more than 0.1 wt% 0.1 wt% Sn-Ag-Cu-GNPs [39 ] Spreading ratio improves gradually with the increase of GNPs and achieved an optimum value with the content of 0.05 wt%, then deteriorated in 0.1 wt% addition 0.05 wt% Sn-Ag-Cu-FNSs [41 ] Contact angle decreased first then decreased with the increase of FNSs content 0.1 wt%
