A Method for Manufacturing Flexible Microfluidic Chip Based on Soluble Material

Table 4

Comparison of different microfabrication methods.

Chip material	Production methods	Manufacturing conditions	Main manufacturing equipment	Important technological process
Glass-silicon wafer	Lithography Lamination adhesive	Vacuum	Lithography 3 steps	Optical lithography; Bonding
Glass-glass	Chemical vapor deposition	High pressure; Elevated temperature	Plasma etching machine 3 steps	Chemical etching; Bonding
PMMA-PMMA	Elevated temperature hot pressing	Elevated temperature and high pressure	Hot press 3 steps	Etching; Elevated temperature bonding
PDMS-glass (PDMS)	The surface modification Adhesion	Room temperature; High pressure	Plasma cleaning machine; 3 steps	Chemical etching; The surface modification bonding
PDMS	3D printing; Dissolve	Room temperature	3D printer; 3 steps	Dissolve; No bonding