Research Article
A Method for Manufacturing Flexible Microfluidic Chip Based on Soluble Material
Table 4
Comparison of different microfabrication methods.
| Chip material | Production methods | Manufacturing conditions | Main manufacturing equipment | Important technological process |
| Glass-silicon wafer | Lithography Lamination adhesive | Vacuum | Lithography 3 steps | Optical lithography Bonding | Glass-glass | Chemical vapor deposition | High pressure Elevated temperature | Plasma etching machine 3 steps | Chemical etching Bonding | PMMA-PMMA | Elevated temperature hot pressing | Elevated temperature and high pressure | Hot press 3 steps | Etching Elevated temperature bonding | PDMS-glass (PDMS) | The surface modification Adhesion | Room temperature High pressure | Plasma cleaning machine 3 steps | Chemical etching The surface modification bonding | PDMS | 3D printing Dissolve | Room temperature | 3D printer 3 steps | Dissolve No bonding |
|
|