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Journal of Nanotechnology
Volume 2012, Article ID 870378, 12 pages
http://dx.doi.org/10.1155/2012/870378
Research Article

SERS Substrates by the Assembly of Silver Nanocubes: High-Throughput and Enhancement Reliability Considerations

1Department of Materials Science and Engineering, University of Maryland, College Park, MD 20742, USA
2Institute for Research in Electronics and Applied Physics, University of Maryland, College Park, MD 20742, USA

Received 3 February 2012; Accepted 21 March 2012

Academic Editor: Mustafa Çulha

Copyright © 2012 Oded Rabin and Seung Yong Lee. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Oded Rabin and Seung Yong Lee, “SERS Substrates by the Assembly of Silver Nanocubes: High-Throughput and Enhancement Reliability Considerations,” Journal of Nanotechnology, vol. 2012, Article ID 870378, 12 pages, 2012. https://doi.org/10.1155/2012/870378.