SERS Substrates by the Assembly of Silver Nanocubes: High-Throughput and Enhancement Reliability Considerations

Figure 1

SEM image of the patterned silicon substrate used for the vertical deposition process. The pattern includes one hundred circular pores, 200 nm in diameter, in a square array surrounded by twenty alignment markers identifying the locations of the columns and rows, and auxiliary identification marks (ring and cross). The spacing between adjacent rows and columns is 5 μm.