Table of Contents Author Guidelines Submit a Manuscript
Journal of Nanotechnology
Volume 2013 (2013), Article ID 296517, 6 pages
Review Article

Carbon Nanotube Composites for Electronic Packaging Applications: A Review

Electronics Packaging Laboratory, Technische Universitat Dresden, Helmholtzstraße 10, 01062 Dresden, Germany

Received 31 August 2012; Revised 10 April 2013; Accepted 22 April 2013

Academic Editor: Carlos R. Cabrera

Copyright © 2013 Lavanya Aryasomayajula and Klaus-Juergen Wolter. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Composite engineering comprises of metal matrix composites. They have high strength-weight ratio, better stiffness, economical production, and ease of availability of raw materials. The discovery of carbon nanotubes has opened new possibilities to face challenges better. Carbon Nanotubes are known for their high mechanical strength, excellent thermal and electrical properties. Recent research has made progress in fabricating carbon nanotube metal matrix and polymer-based composites. The methods of fabrication of these composites, their properties and possible applications restricted to the field of electronic packaging have been discussed in this paper. Experimental and theoretical calculations have shown improved mechanical and physical properties like tensile stress, toughness, and improved electrical and thermal properties. They have also demonstrated the ease of production of the composites and their adaptability as one can tailor their properties as per the requirement. This paper reviews work reported on fabricating and characterizing carbon- nanotube-based metal matrix and polymer composites. The focus of this paper is mainly to review the importance of these composites in the field of electronics packaging.