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Journal of Sensors
Volume 2014, Article ID 952323, 7 pages
http://dx.doi.org/10.1155/2014/952323
Research Article

Analysis on Structural Stress of 64 × 64 InSb IRFPAs with Temperature Dependent Elastic Underfill

1School of Electrical Engineering, Henan University of Science and Technology, Luoyang 471023, China
2Luoyang Institute of Electro-Optical Equipment, Aviation Industry Corporation of China, Luoyang 471009, China

Received 6 May 2014; Revised 7 August 2014; Accepted 7 August 2014; Published 26 August 2014

Academic Editor: Laurent Francis

Copyright © 2014 Liwen Zhang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Liwen Zhang, Wei Tian, Qingduan Meng, Mengfang Sun, Na Li, and Zhen Lei, “Analysis on Structural Stress of 64 × 64 InSb IRFPAs with Temperature Dependent Elastic Underfill,” Journal of Sensors, vol. 2014, Article ID 952323, 7 pages, 2014. https://doi.org/10.1155/2014/952323.