Journal of Sensors / 2014 / Article / Fig 1

Research Article

Analysis on Structural Stress of 64 × 64 InSb IRFPAs with Temperature Dependent Elastic Underfill

Figure 1

Evolution of CTE α with temperature for (a) underfill and (b) InSb, silicon, and indium.
952323.fig.001a
(a)
952323.fig.001b
(b)