Design and Evaluation of a Multidirectional Thermal Flow Sensor on Flexible Substrate

Figure 2

The sensor fabrication process. (a) Standard PCB photolithography was utilized for patterning copper onto the prelaminated Kapton film. (b) Thermistors were soldered, and the packaging was fitted. (c) The device’s upper surface with the heater and the sensing elements and (d) the bottom surface which faces the flow channel.

(a)

(b)

(c)

(d)