Table of Contents Author Guidelines Submit a Manuscript

Cost-Effective Techniques for Sensors Technology

Call for Papers

The concept of the Internet of Things (IoT) has opened a new paradigm in the interaction between objects and human beings. In the IoT, sensors play a fundamental role in extracting valuable information regarding the object and its surroundings. As the number of sensing devices increases, however, their cost and their environmental impact are gradually becoming a substantial issue. Among the many proposed solutions to tackle it, printed electronics represent a very promising candidate, due to their wide applicability in the realization of large area, flexible, environmentally friendly, and potentially cost-effective sensors and devices. Particularly, techniques such as inkjet printing and spray deposition and other novel additive manufacturing processes indicated the path towards a new, uncharted territory: the realization of sensors, actuators, circuits, and smart objects with very low barriers to entry. However, all that glitters is not gold, and some of the promises made by the advocates of these emerging technologies have not been fully met yet. In fact, the impossibility of obtaining consumer home-printable electronics or low-cost flexible sensing nodes for the Internet of Things is subject to two main drives: cost of equipment and materials and their easy availability in the general market.

We firmly believe that the diffusion of printed and organic electronics to every target group (households, research labs, and industries) passes through the development of truly cost-effective and reliable solutions. This special issue, by collecting in one place the most promising works in this field, would represent the perfect medium to boost it.

In this special issue, we want to collect a number of contributions to explore novel materials, configurations, layered patterns and applications, equipment, and deposition techniques, characterized by low cost, high efficiency, and easy availability.

Potential topics include but are not limited to the following:

  • Tweaked commercial instruments
  • Unconventional 2D and 3D material deposition for physical and chemical sensing
  • Integration of multiple deposition techniques in one apparatus
  • 3D printed “sensing objects”
  • Employment of nanomaterials and polymers for sensing and communication
  • Printed sensors
  • Integration of low-cost sensors

Authors can submit their manuscripts through the Manuscript Tracking System at https://mts.hindawi.com/submit/journals/js/cetst/.

Submission DeadlineFriday, 13 July 2018
Publication DateNovember 2018

Papers are published upon acceptance, regardless of the Special Issue publication date.

Lead Guest Editor

Guest Editors