Modeling the Structural-Thermal-Electrical Coupling in an Electrostatically Actuated MEMS Switch and Its Impact on the Switch Stability

Table 1

Geometrical and thermomechanical properties of the switch.

Young’s modulus 𝐸	78 GPa
Coefficient of thermal expansion 𝛼	14×10^−6 K^−1
Thermal conductivity 𝑘	318 W/mK
Length	50 µm
Thickness	1.5 µm
Gap	1.52 µm
Substrate temperature 𝑇𝑆	40°C
𝑥1	4 µm
𝑥2	13 µm
𝑥3	38 µm