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Mathematical Problems in Engineering
Volume 2013, Article ID 698360, 6 pages
Research Article

Formulation and Implementation of Energy Efficient Ultraviolet Curing for Photosensitive Resin-Bound Diamond Wire Saws

Key Laboratory of E&M Zhejiang University of Technology, Ministry of Education & Zhejiang Province, Hangzhou 310023, China

Received 3 January 2013; Revised 10 March 2013; Accepted 2 April 2013

Academic Editor: Shengyong Chen

Copyright © 2013 Chunyan Yao et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


It is a currently dominant method to use wire saws for cutting silicon material because of its production efficiency and energy efficiency. Diamond wire saws, or fixed abrasive wire saws, have attracted much attention to researchers and engineers due to many advantages, including high cutting efficiency and low environmental pollution. This paper develops a novel diamond wire saw using ultraviolet curing technology. High-strength piano wires and polyethylene wires are selected as wire cores, and photosensitive resin is used as the binder. The problem of wire saw strength is mathematically formulated, and the effective parameters are analyzed. The surface morphology is analyzed for the developed diamond wire saw. A series of cutting experiments with different saws of varying manufacturing parameters are carried out. The slicing performance of such diamond wire saws is evaluated and compared. The experimental results show that the developed saw using the photosensitive resin has a very good performance in slicing silicon ingots. By the comparison between the developed diamond wire saw and the electroplated diamond wire saw, the surface smoothness of the workpiece is better than that by the latter.