Formulation and Implementation of Energy Efficient Ultraviolet Curing for Photosensitive Resin-Bound Diamond Wire Saws

Table 1

Experimental conditions in the slicing process.

Item	Value
Wire sawing machine	WXD170
Workpiece	Φ 44 mm silicon ingot
Wire saw diameter (mm)	Φ 0.28
Wire saw line speed (m/min)	2.5
Wire saw feed speed (mm/min)	0.375
Workpiece rotate speed (rpm)	3.5
Wire tension (MPa)	0.2
Coolant	tap water