Journals
Publish with us
Publishing partnerships
About us
Blog
Mathematical Problems in Engineering
Journal overview
For authors
For reviewers
For editors
Table of Contents
Special Issues
Mathematical Problems in Engineering
/
2015
/
Article
/
Tab 1
/
Research Article
The Variations of Thermal Contact Resistance and Heat Transfer Rate of the AlN Film Compositing with PCM
Table 1
Physical properties of AlN and Cu.
AlN
Cu
Melting point (°C)
2200
1082
Thermal conductivity (W/m°C)
140–180
398