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Mathematical Problems in Engineering
Volume 2015, Article ID 369581, 15 pages
Research Article

Analytical Solutions of Heat Transfer and Film Thickness with Slip Condition Effect in Thin-Film Evaporation for Two-Phase Flow in Microchannel

1Faculty of Mechanical Engineering, Universiti Teknikal Malaysia Melaka (UTeM), Melaka, Malaysia
2Department of Mechanical Engineering, Thi-Qar University, 64001 Nassiriya, Iraq

Received 20 June 2014; Revised 24 November 2014; Accepted 25 November 2014

Academic Editor: Salvatore Alfonzetti

Copyright © 2015 Ahmed Jassim Shkarah et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Physical and mathematical model has been developed to predict the two-phase flow and heat transfer in a microchannel with evaporative heat transfer. Sample solutions to the model were obtained for both analytical analysis and numerical analysis. It is assumed that the capillary pressure is neglected (Morris, 2003). Results are provided for liquid film thickness, total heat flux, and evaporating heat flux distribution. In addition to the sample calculations that were used to illustrate the transport characteristics, computations based on the current model were performed to generate results for comparisons with the analytical results of Wang et al. (2008) and Wayner Jr. et al. (1976). The calculated results from the current model match closely with those of analytical results of Wang et al. (2008) and Wayner Jr. et al. (1976). This work will lead to a better understanding of heat transfer and fluid flow occurring in the evaporating film region and develop an analytical equation for evaporating liquid film thickness.