Research Article
Anomaly Detection and Degradation Prediction of MOSFET
Table 1
Typical failure modes [12].
| ||||||||||||||||||||||||||||||||||||||||||||
A: brittle fracture failure; C: plastic failure; AN: secondary breakdown; E: gum-off; AM: overheating stress breakdown; B: medium yield; Q: elastic deformation; X: EOS/ESD; J: corrosion; K: crystal which is too large; M: penetration and diffusion; L: increased fatigue crack depth; R: fatigue cracks; T: electromigration; Z: metallic material migration; U: oxide layer failure; AD: TDDB breakdown. |