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Mathematical Problems in Engineering
Volume 2015, Article ID 713501, 13 pages
Research Article

Electromechanical Impedance Analysis on Piezoelectric Smart Beam with a Crack Based on Spectral Element Method

School of Civil Engineering and Mechanics, Huazhong University of Science and Technology, Wuhan 430074, China

Received 11 April 2014; Revised 6 July 2014; Accepted 16 July 2014

Academic Editor: Kui Fu Chen

Copyright © 2015 Dansheng Wang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


An electromechanical impedance (EMI) analysis of a piezoelectric smart beam with a crack is implemented in this paper. Spectral element method (SEM) is used to analyze the EMI response of the piezoelectric smart beam. In this analysis, the spectral element stiffness matrices of different beam segments are derived in this paper. The crack is simulated using spring models, and the EMI signatures of piezoelectric smart beam with and without crack are calculated using SEM, respectively. From the analysis results, it is found that the peak position and amplitude of the EMI signatures have significant changes with the change in crack depth, especially in higher frequency ranges. Different vibration modes of the piezoelectric smart beam are analyzed, and the effect of thickness of the adhesive layer on the admittance is also researched. An experimental study is also implemented to verify the validity of the analysis results using SEM.