Research Article

Numerical Simulation, Analysis, and Fabrication of MEMS-Based Solid Ag and Cu Microneedles for Biomedical Applications

Figure 26

Graphical analysis of simulation results of deflection for both silver and copper microneedles. (a) Tip deflection comparison when stress is applied on both microneedles. (b) Fracture strength comparison based on the observed results of deflection.
(a)
(b)