Ultrasonic Spray Pyrolysis Deposited Copper Sulphide Thin Films for Solar Cell Applications

<div>X-ray diffraction patterns of Cu<sub><i>x</i></sub>S thin film (TF1) deposited at a substrate temperature of 240°C. The diffraction planes were matched with JCPDS card number 6-0464.</div>

Scanning

fig1

Figure 1

Figure 1: Ultrasonic Spray Pyrolysis Deposited Copper Sulphide Thin Films for Solar Cell Applications 