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Volume 2017, Article ID 6215691, 7 pages
Research Article

In Situ SEM Torsion Test of Metallic Glass Microwires Based on Micro Robotic Manipulation

1Department of Mechanical and Biomedical Engineering, City University of Hong Kong, Kowloon, Hong Kong
2Center for Advanced Structural Materials (CASM), Shenzhen Research Institute, City University of Hong Kong, Shenzhen 518057, China
3Centre for Robotics and Automation, Shenzhen Research Institute, City University of Hong Kong, Shenzhen 518057, China

Correspondence should be addressed to Yajing Shen; kh.ude.uytic@nehsijay and Yang Lu; kh.ude.uytic@ulgnay

Received 24 March 2017; Accepted 25 July 2017; Published 23 August 2017

Academic Editor: Nicolas Delorme

Copyright © 2017 Chenchen Jiang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Microwires, such as metallic, semiconductor, and polymer microwires and carbon fibers, have stimulated great interest due to their importance in various structural and functional applications. Particularly, metallic glass (MG) microwires, because of their amorphous atoms arrangement, have some unique mechanical properties compared with traditional metals. Despite the fact that substantial research efforts have been made on the mechanical characterizations of metallic glass microwires under tension or flexural bending, the mechanical properties of microwires under torsional loading have not been well studied, mainly due to the experimental difficulties, such as the detection of torsion angle, quantitative measurement of the torsional load, and the alignment between the specimen and torque meter. In this work, we implemented the in situ SEM torsion tests of individual La50Al30Ni20 metallic glass (MG) microwires successfully based on a self-developed micro robotic mechanical testing system. Unprecedented details, such as the revolving vein-pattern along the torsion direction on MG microwires fracture surface, were revealed. Our platform could provide critical insights into understanding the deformation mechanisms of other microwires under torsional loading and can even be further used for robotic micromanufacturing.